Spectroscopic Reflectometry

Unparalleled precision using multi-angled reflectometry

We proud to represent Bruker Nano, Inc., manufacturers of advanced semiconductor metrology systems. 

Bruker is a leading innovator and provider of the advanced FilmTek™ metrology systems and analysis software to major companies in the semiconductor, optoelectronics, data storage, display, MEMS, and optical coating industries.

Our mission is to solve our clients’ most critical metrology challenges by providing leading-edge solutions to precisely suit their requirements. We value close cooperation and long-term partnership to understand and anticipate your current and future needs.

An extensive portfolio of key patents is held allowing for the highest measurement accuracy in the industry whilst maintaining low-cost solutions for high-throughput, including fully-automated mapping of patterned wafers for development and production environments.

We can supply the following range of Bruker FilmTek™ systems for Spectroscopic Reflectometry measurements

FilmTek 2000 PAR

A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.

FilmTek 2000M

Micro-spot size benchtop metrology system engineered for unparalleled versatility and high performance, meeting the needs of patterned film applications requiring a very small spot size. Allows for measurement spot sizes as small as 2µm, and delivers reliable measurement of both thin and thick films.

FilmTek 2000

Automated metrology system designed for rapid, reliable, and accurate characterization of nearly any unpatterned thin film. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter. Capable of simultaneous determination of multiple film characteristics within a fraction of 1 second per site.