Exatron’s Diamond Particlization Process for IC interconnection is a modern state-of-the-art test socket contact system technology that can also be applied to other electronics applications.
The wide range of applications include IC test sockets, CSP sockets, universal test sockets, MEMS sockets, RF zero sockets, multisite sockets, as well as high density interconnects, replacement handler contacts and EMI shielding. PI can also be plated directly onto PCBs for a variety contact needs.
Something to keep in mind that may save the day. The above image shows what can happen when your expensive rocker style test socket wears out the traces on your very expensive printed circuit board.
The cost and time to respin the PCB and replace the expensive rocker test socket can become a difficult issue. Exatron’s Diamond Particle Interconnect (PI) Socket Saver® can now come to your rescue!
Self-cleaning, wiping, roll, rocker-type contacts are well known for wearing out the PCB pads and traces. PI cleans without wiping and wearing out boards and is a much better contact system.
Socket Saver is a PI sheet of Kapton with Diamond Particle Interconnect material plated longer on the bottom to connect to areas that are not worn out on your PCB. Socket Saver is used as a shim under the socket.
This will restore your socket operation to like new condition and can save an expensive board spin. Rejuvenate with the Socket Saver. Bring worn out expensive printed circuit boards back to life and save your expensive socket and PCB. Don’t spin, think Exatron “Socket Saver” instead.